Teledyne Microelectronic Technologies A Teledyne Technologies Company   

Home    Company Info    Products & Services    Teledyne Companies

New Products
HRIP SFF Fiber Optic Devices
Alphalight™ LED Backlights

Packaging Solutions
Mixed Signal
LED Backlights & Illuminators
Secure Communications


Standard Products
Radiation Dosimeter
Fiber Optic Products

Company Info
About Us
Quality Assurance
Press Releases
Environmental Policy
Terms and Conditions
Supplier Information

Contact Us
Sales Representatives
Map & Directions

Teledyne Microelectronic Technologies, has been a partner with leading medical device manufacturers in a broad array of therapeutic and diagnostic categories. From the early stages of implantable cardiac pacemakers and defibrillators, to drug pumps and audiology devices, we have a rich history of supporting medical innovations. With best-in-class design and fabrication capabilities, we provide elegant, integrated solutions to complex electronic designs that guarantee seamless transition from proof of concept, to pre-production, to high-volume manufacturing. For projects large or small, Teledyne Microelectronic Technologies brings with it the pedigree, depth of experience, and breadth of knowledge needed to solve the most complex issuesWe invite you to take a closer look at the portfolio of products we have developed, and click on the underlying technologies to learn more.


High-temperature cofired ceramic (HTCC) substrate. Power hybrid technology. RTV protection fill.

 Image Magnification: 1x

High-temperature cofired ceramic (HTCC) substrate. Conventional, digital/analog chip & wire technology.

 Image Magnification Approx: 1x

Multilayer rigid laminate substrate. SMT assembly of chip & wire PBGAs.

 Image Magnification Approx: 0.5x 

Fine-line ceramic multilayer substrate. Combination of conventional chip & wire technology with SMT. Additional RF elements for in-process tuning.

 Image Magnification: 0.5x

Multilayer flex substrate. Flip-chip attached active components, SMT assembled passives. 3D integration through flex folding.

 Image Magnification Approx: 5x

Multilayer rigid-flex substrate. SMT assembly with CSP-packaged active components. CSPs are based on fine-line ceramic multilayer substrate and flip-chip attachment.

 Image Magnification Approx: 0.5x

Multilayer rigid laminate substrates. Flip-chip attached active components, SMT assembled passives. 3D integration through board stacking.

 Image Magnification Approx: 7x

MEMS die and fine-line flex interposer. Low-stress integration using
TAB technology.

 Image Magnification Approx: 2x

Multilayer ceramic substrate. Substrate assembly using flip-chip , chip&wire , and SMT technologies. 3D integration of optical and RF elements.

 Image Magnification Approx: 2x

Multilayer flex substrate. SMT assembly. 3D integration through flex folding. Assembly of power, RF , sensor and transducer elements to create a
finished product.

 Image Magnification Approx: 1x

Home | ISO 9001 | Terms of Use | Careers | Search | Contact

Teledyne Microelectronics • 12964 Panama Street, Los Angeles, CA 90066
310.822.8229 • 800.518.1015 |
Copyright © 2008 Teledyne Technologies Incorporated. All rights reserved.